Fundamentals of Lead-Free Solder Interconnect Technology: From Microstructures to Reliability

by Hongtao Ma, Tae-Kyu Lee, Choong-Un Kim, et al.

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This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include the reliability of lead-free soldering, tin whiskering and electromigration, in addition to emerging technologies and research.

Format:Hardcover

Language:English

ISBN:1461492653

ISBN13:9781461492658

Release Date:November 2014

Publisher:Springer

Length:253 Pages

Weight:1.22 lbs.

Dimensions:0.6" x 6.1" x 9.2"

Related Subjects

Engineering Science Science & Math Science & Scientists Science & Technology Technology

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Fundamentals of Lead-Free Solder Interconnect Technology: From Microstructures to Reliability

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