Three Dimensional System Integration: IC Stacking Process and Design

by Riko Radojcic and Antonis Papanikolaou

No Customer Reviews

Select Format

Select Condition

Book Overview

The next step in system integration: the benefits of going 3-D.- Process technology for manufacturing Through-Silicon Vias (TSVs).- Alternative 3D integration schemes.- Manufacturing issues in 3D stacked ICs.- TSV characterization.- Physical design of 3D stacked ICs.- DRAM on logic stacking.- 3D general purpose micro-processors.- 3D system design: a holistic design approach.

Format:Hardcover

Language:English

ISBN:1441909613

ISBN13:9781441909619

Release Date:December 2010

Publisher:Springer

Length:246 Pages

Weight:1.26 lbs.

Dimensions:0.8" x 6.1" x 9.2"

Related Subjects

Architecture Computers Computers & Technology Engineering Technology

Customer Reviews

0 rating

Write a review

ThriftBooks sells millions of used books at the lowest everyday prices. We personally assess every book's quality and offer rare, out-of-print treasures. We deliver the joy of reading in recyclable packaging with free standard shipping on US orders over $15. ThriftBooks.com. Read more. Spend less.

Copyright © 2025 Thriftbooks.com Terms of Use | Privacy Policy | Do Not Sell/Share My Personal Information | Cookie Policy | Cookie Preferences | Accessibility Statement
ThriftBooks ^® and the ThriftBooks ^® logo are registered trademarks of Thrift Books Global, LLC

Three Dimensional System Integration: IC Stacking Process and Design

Select Format

Select Condition

Recommended

Book Overview

Customer Reviews

Popular Categories

Website

My Account

Partnerships

Quick Help

About Us

Follow Us